Publications
2024
Automated Characterisation of Printed Electronics Under Adjustable Ambient Conditions
Ungerer, M.; Chen, Z.; Mach, T. P.; Reichert, K.-M.; Gengenbach, U.; Lindmüller, M.; Binder, J. R.; Reischl, M.; Koker, L.
2024. 2024 International Semiconductor Conference (CAS), Sinaia, Romania, 09-11 October 2024, 69–72, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/CAS62834.2024.10736741
Ungerer, M.; Chen, Z.; Mach, T. P.; Reichert, K.-M.; Gengenbach, U.; Lindmüller, M.; Binder, J. R.; Reischl, M.; Koker, L.
2024. 2024 International Semiconductor Conference (CAS), Sinaia, Romania, 09-11 October 2024, 69–72, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/CAS62834.2024.10736741
Investigation of solution processable moisture barrier films based on a polymer and filler materials
Chen, Z.; Gengenbach, U.; Gananian, S.; Moser, D.; Reichert, K.-M.; Koker, L.
2024. IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2024), Tampere, Finland, June 30–July 3, 2024
Chen, Z.; Gengenbach, U.; Gananian, S.; Moser, D.; Reichert, K.-M.; Koker, L.
2024. IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2024), Tampere, Finland, June 30–July 3, 2024
Investigation of solution processable moisture barrier films based on a polymer and filler materials
Chen, Z.; Gengenbach, U.; Gananian, S.; Moser, D.; Reichert, K.-M.; Koker, L.
2024. IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS 2024), IEEEXplore
Chen, Z.; Gengenbach, U.; Gananian, S.; Moser, D.; Reichert, K.-M.; Koker, L.
2024. IEEE International Conference on Flexible Printable Sensors and Systems (FLEPS 2024), IEEEXplore
Systematic Investigation of Novel, Controlled Low‐Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink
Chen, Z.; Gengenbach, U.; Koker, L.; Huang, L.; Mach, T. P.; Reichert, K.-M.; Thelen, R.; Ungerer, M.
2024. Small, 20 (21), Art.-Nr.: 2306865. doi:10.1002/smll.202306865
Chen, Z.; Gengenbach, U.; Koker, L.; Huang, L.; Mach, T. P.; Reichert, K.-M.; Thelen, R.; Ungerer, M.
2024. Small, 20 (21), Art.-Nr.: 2306865. doi:10.1002/smll.202306865
2022
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
Chen, Z.; Gengenbach, U.; Liu, X.; Scholz, A.; Zimmermann, L.; Aghassi-Hagmann, J.; Koker, L.
2022. Micromachines, 13 (4), 583. doi:10.3390/mi13040583
Chen, Z.; Gengenbach, U.; Liu, X.; Scholz, A.; Zimmermann, L.; Aghassi-Hagmann, J.; Koker, L.
2022. Micromachines, 13 (4), 583. doi:10.3390/mi13040583
2020
Hybrid low-voltage physical unclonable function based on inkjet-printed metal-oxide transistors
Scholz, A.; Zimmermann, L.; Gengenbach, U.; Koker, L.; Chen, Z.; Hahn, H.; Sikora, A.; Tahoori, M. B.; Aghassi-Hagmann, J.
2020. Nature Communications, 11 (1), Art.-Nr. 5543. doi:10.1038/s41467-020-19324-5
Scholz, A.; Zimmermann, L.; Gengenbach, U.; Koker, L.; Chen, Z.; Hahn, H.; Sikora, A.; Tahoori, M. B.; Aghassi-Hagmann, J.
2020. Nature Communications, 11 (1), Art.-Nr. 5543. doi:10.1038/s41467-020-19324-5
Approaches for Solution-Processed Encapsulation of Printed Medical Wearable Devices
Chen, Z.; Gengenbach, U.; Koker, L.; Mansour, M.
2020. Current directions in biomedical engineering, 6 (3), 131–134. doi:10.1515/cdbme-2020-3034
Chen, Z.; Gengenbach, U.; Koker, L.; Mansour, M.
2020. Current directions in biomedical engineering, 6 (3), 131–134. doi:10.1515/cdbme-2020-3034