Joaquin Eduardo Urrutia Gómez
Research Area Automation for Laboratories (ATLAS)
Group Machine Learning for High-Throughput Methods and Mechatronics (ML4HOME)
- CN
- joaquin urrutia-gomez ∂ kit edu
Publications
2024
Enhancing Temperature Responsiveness of PNIPAM Through 3D‐Printed Hierarchical Porosity
Liu, W.; Wang, Z.; Serna, J. A.; Debastiani, R.; Gomez, J. E. U.; Lu, L.; Yang, W.; Dong, Z.; Levkin, P. A.
2024. Advanced Functional Materials, Artkl.Nr.: 2403794. doi:10.1002/adfm.202403794
Liu, W.; Wang, Z.; Serna, J. A.; Debastiani, R.; Gomez, J. E. U.; Lu, L.; Yang, W.; Dong, Z.; Levkin, P. A.
2024. Advanced Functional Materials, Artkl.Nr.: 2403794. doi:10.1002/adfm.202403794
Digital twin of a droplet microarray platform: Evaporation behavior for multiple droplets on patterned chips for cell culture
Wu, Y.; Urrutia Gómez, J. E.; Zhang, H.; Wang, F.; Levkin, P. A.; Popova, A. A.; Nestler, B.
2024. Droplet, 3 (1), Art.-Nr. e94. doi:10.1002/dro2.94
Wu, Y.; Urrutia Gómez, J. E.; Zhang, H.; Wang, F.; Levkin, P. A.; Popova, A. A.; Nestler, B.
2024. Droplet, 3 (1), Art.-Nr. e94. doi:10.1002/dro2.94
2023
Automated high-throughput image processing as part of the screening platform for personalized oncology
Schilling, M. P.; El Khaled El Faraj, R.; Urrutia Gómez, J. E.; Sonnentag, S. J.; Wang, F.; Nestler, B.; Orian-Rousseau, V.; Popova, A. A.; Levkin, P. A.; Reischl, M.
2023. Scientific Reports, 13, Article no: 5107. doi:10.1038/s41598-023-32144-z
Schilling, M. P.; El Khaled El Faraj, R.; Urrutia Gómez, J. E.; Sonnentag, S. J.; Wang, F.; Nestler, B.; Orian-Rousseau, V.; Popova, A. A.; Levkin, P. A.; Reischl, M.
2023. Scientific Reports, 13, Article no: 5107. doi:10.1038/s41598-023-32144-z
2021
Grid Screener: A Tool for Automated High-throughput Screening on Biochemical and Biological Analysis Platforms
Schilling, M. P.; Schmelzer, S.; Gómez, J. E. U.; Popova, A. A.; Levkin, P. A.; Reischl, M.
2021. IEEE access, 9, 166027–166038. doi:10.1109/ACCESS.2021.3135709
Schilling, M. P.; Schmelzer, S.; Gómez, J. E. U.; Popova, A. A.; Levkin, P. A.; Reischl, M.
2021. IEEE access, 9, 166027–166038. doi:10.1109/ACCESS.2021.3135709